由於半導體製程日新月異，環保署針對園區高科技產業廢水排放已開始訂定放流水鈷濃度標準需要管制在限值1.0 mg/L以下，使得各園區廠商開始注重其放流水中的鈷濃度想辦法將廢水中的鈷降低，尤其在半導體製程中含有鈷，無法直接排放至放流口。因此本研究以某園區半導體實廠含鈷製程排水，並利用商用D5843樹脂處理水中鈷濃度，探討其處理可行性並評估實廠操作參數。在吸附實驗中得出吸附平衡時間為240分鐘，最大吸附容量分別為化學機械研磨廢水(67.38 mg/g)、電化學電鍍廢水(84.97 mg/g)，最佳pH值為4~8。
其中發現商用D5843螯合樹脂以實廠電化學電鍍廢水原始含鈷濃度50 mg/L達到吸附平衡時實驗終點為含鈷 0.1208 mg/L，實廠化學機械研磨廢水原始含鈷濃度 2 mg/L到吸附平衡時實驗終點為含鈷 1.4572 mg/L，以放流水標準須達到含鈷限值1.0 mg/L以下為標準則顯示化學機械研磨廢水並不適用於商用D5843螯合樹脂，尋找與分析廢水基本特性推論化學機械研磨廢水中的各類溶劑(pH緩衝劑、界面活性劑、氧化劑)會影響樹脂吸附；則對於電化學電鍍廢水，商用D5843樹脂表現出良好的吸附效果與適性範圍，結果顯示商用D5843樹脂具有處理電化學電鍍廢水潛力，並推估其實廠吸附飽和時間與實廠運轉參數。

Owing to the ever-changing semiconductor manufacturing process, the Environmental Protection Agency has started to set standards for the cobalt concentration in the discharge water for high-tech industrial(<1mg/L), which has led various manufacturers to pay attention to the cobalt concentration in their discharge water and find ways to reduce it, especially in semiconductor industry. Therefore, this study uses commercial chelating ion exchange resins(D5843) to treat cobalt-containing wastewaters in semiconductor industry wastewater, and discuss its treatment feasibility and evaluate the operating parameters. In this study, we found adsorption equilibrium time is 240 minutes, the maximum adsorption capacity is Chemical-Mechanical Planarization(CMP) wastewater (67.38 mg/g), Electrochemical Plating(ECP) wastewater (84.97 mg/g), and the optimal pH value is 4-8.
Among them, it was found that the commercial resin D5843 reached the adsorption end point(0.1208 mg/L of cobalt concentration)in the ECP wastewater(50 mg/L), and the adsorption end point(1.4572 mg/L of cobalt concentration)in the CMP wastewater(2 mg/L) The standard of discharged water must be below the limit of 1.0 mg/L of cobalt, it shows that CMP wastewater is not suitable for commercial resin D5843.It is inferred that various solvents (pH buffers, surfactants, oxidants) in the CMP wastewater affect the resin adsorption; For ECP wastewater, commercial D5843 resin showed good adsorption capacity and adaptability range. The results show that commercial D5843 resin has the potential to treat ECP wastewater, and the adsorption saturation time and operating parameters in manufacturing plant are estimated.

目錄
摘要.............................I
ABSTRACT........................II
目錄............................III
表目錄...........................V
圖目錄...........................VI
第一章 緒 論...................1
1.1 研究緣起.....................1
第二章 文獻回顧...................3
2.1 半導體廠製程排水來源..........3
2.2 電化學電鍍製程...............6
2.2.1電化學電鍍製程的理論.........7
2.2.2電化學電鍍廢水...............7
2.3 化學機械研磨..................9
2.3.1化學機械研磨的理論...........9
2.3.2化學機械研磨液的特性與成分....10
2.3.3化學機械研磨廢水.............11
2.4 半導體廠廢水處理技術..........13
2.5離子交換技術..................16
2.6 離子交換樹脂分類.............18
2.7 樹脂處理重金屬廢水...........20
第三章 研究方法..................26
3.1 研究架構....................26
3.2 半導體製程排水來源及水質分析..27
3.2.1 水質分析方法...............27
3.3 吸附特性實驗.................34
第四章 結果與討論................37
4.1 樹脂吸附特性實驗.............37
4.1.1平衡時間測定與不同初始濃度...37
4.1.2等溫吸附曲線趨勢分析.........41
4.1.3等溫吸附方程式..............43
4.1.4 pH值趨勢分析...............46
4.2 實廠模擬實驗.................48
4.3 數據綜合分析.................53
第五章 結論與建議................59
5.1 結論........................59
5.2 建議........................60
參考文獻.........................61

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