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In recent years, public events with respect to occupational hazards have been occurring frequently in many working places in Taiwan, and the prevention of the threat has raised a large concern. To reduce the occupational risk and protect both the workers and users from exposing toxic substances, many companies follow the Restriction of Hazardous Substances (RoHS) directives to develop and manufacture their products. According to the directives, conventionally lead-containing adhesives have to be replaced with lead-free substitutes for electronic packaging. Sintering plays a crucial role in the function of the adhesives. However, the optimal conditions for the lead-free substitutes to perform the acceptable credibility have not been studied and compared yet. This study will use the Taguchi method to optimize the sintering conditions for both lead and lead-free adhesive materials, and their adhesion strength will be evaluated through a series of reliability tests. The results of short term test show that the lead-containing material exhibited better performance than the substitutes in tensile, bending, and drop tests, and show positive correction with lead adhesive, but the results of long term test that the resistance of thermal shock test is larger than lead-containing material. The results of short term test show that the lead-free containing material exhibited poorer performance than the results of long term test, and the results of long term test better performance than the substitutes in the test of steam digester and Highly-Accelerated Temperature and Humidity Stress test. |